Chip Fabrication Process Engineer

14 hours ago


George Town, Penang, Malaysia Broadcom Full time 90,000 - 120,000 per year

Job Description:
Position Summary
We are seeking a highly motivated and experienced professional with a strong background in Electrical & Electronics/Optics engineering and proven expertise in Wafer Chip Fabrication processing from wafer to chip-out.

Key Responsibilities

  • ⁠ Managing Contract Manufacturer (CM) engineering activities.
  • Drive yield improvement by identifying root causes, implementing corrective actions, and optimizing key process parameters.
  • Perform data analysis using tools such as JMP to monitor performance and provide actionable insights.
  • Collaborate with cross-functional teams including production, quality, and equipment engineering to ensure stable operations and timely delivery.
  • Support new product/technology introductions, equipment qualification, and capacity ramp-up activities.
  • Establish and maintain standard operating procedures (SOPs), process controls, and best practices to enhance efficiency and product quality.
  • Troubleshoot process issues at Contract Manufacturers (CMs) and ensure effective implementation of corrective actions.
  • Provide technical guidance and support to operators and technicians to sustain daily manufacturing operations.

Qualifications

  • Bachelor's or Master's degree in Electrical & Electronics Engineering, Semiconductor Manufacturing, fiber optics/photonics product engineering or a related field.
  • Minimum 3 years of experience in backend wafer processing (from wafer to chip-out).
  • Strong leadership skills with experience managing teams and driving cross-functional initiatives.
  • Proven track record in yield improvement projects and problem-solving in semiconductor manufacturing.
  • Proficient in JMP software and capable of leveraging it for data analysis and decision-making.
  • Excellent communication, analytical, and project management skills.

R024088



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