Molding Process and Equipment Engineer

About the role

Responsible for ensuring high performance, reliability, and continuous improvement of molding and encapsulation equipment (e.g., BIM modules, degating, and related systems) used in semiconductor manufacturing. 

The Molding Equipment Engineer supports production stability by maintaining equipment health, driving process improvement, and supporting new package qualifications to achieve optimal OEE, yield, and CPK performance. 

What you will do:

1. Equipment Performance & Maintenance 

- Ensure molding and encapsulation machines BIM run within specification and support production targets with minimal downtime. 

- Plan and execute preventive and predictive maintenance schedules to maximize machine uptime. 

- Lead root cause analysis and implement permanent corrective actions for equipment breakdowns or recurring issues. 

- Support 24/7 production operations through timely troubleshooting and coordination with technicians and process teams. 

- Monitor and track equipment downtime, error codes, and MTBF/MTTR performance to identify improvement opportunities. 

2. Equipment Improvement & Optimization 

- Analyze equipment performance data to improve OEE, yield, and CPK stability. 

- Drive equipment enhancement projects such as hardware upgrades, parameter optimization, and automation improvements. 

- Collaborate with process engineers to optimize molding pressure, temperature, vacuum, and transfer time for new or existing products. 

- Lead projects to address equipment obsolescence or end-of-life components through local or global sourcing initiatives. 

3. Equipment Qualification & Projects 

- Support new equipment installation, commissioning, and buy-off (FAT/SAT) with vendors and internal stakeholders. 

- Conduct equipment capability studies and qualification runs for new product introduction (NPI) and process transfers. 

- Collaborate with global equipment teams, vendors, and suppliers for continuous improvement and cost-saving projects. 

- Prepare and review machine documentation such as manuals, diagrams, BOMs, calibration records, and risk assessments. 

4. Documentation & Compliance 

- Maintain up-to-date records for equipment maintenance, modification, and spare part inventory. 

- Ensure compliance with EHS, ISO, and corporate QMS standards in all engineering activities. 

- Prepare periodic engineering reports, downtime paretos, and cost analyses for management review. 

- Support audits and equipment safety verifications as part of corporate or customer requirements. 

5. Cross-Functional & Technical Support 

- Provide technical training to maintenance technicians on troubleshooting and equipment setup. 

- Work closely with Facilities (e.g., DI water, vacuum, chiller) and Process Engineering to ensure stable machine performance. 

- Support yield improvement, solderability, and reliability enhancement activities. 

- Participate in global benchmarking and supplier evaluation to identify new technologies or process improvements. 

III. Skills / Competencies 

A. Technical Competencies 

- Strong knowledge of molding/encapsulation machine systems (hydraulic, pneumatic, servo, temperature control, vacuum). 

- Familiar with BIM modules, FICO tooling interfaces, and related automation. 

- Proficient in troubleshooting control systems, sensors, heaters, and cooling systems. 

- Hands-on experience in equipment buy-off, qualification, and capability studies (CPK, GR&R). 

- Knowledge of preventive maintenance planning, spare parts management, and cost improvement projects. 

- Familiar with OEE monitoring, downtime tracking, and SPC tools. 

B. Soft Skills 

- Analytical and systematic in problem solving (5-Why, Fishbone, DMAIC). 

- Strong communication and teamwork skills across Production, Process, and Facilities teams. 

- Able to manage multiple priorities and work under pressure. 

- Proactive mindset with high ownership and accountability. 

What you will need:

- Education: Bachelor's Degree in Mechanical, Electrical, Mechatronic, or Manufacturing Engineering. 

- Experience: Minimum 3–5 years of experience in molding or encapsulation equipment engineering in a semiconductor or precision manufacturing environment. 

- Other Requirements: 

  - Willing to work on production floor and cleanroom environment. 

  - Familiar with semiconductor molding materials and process flow. 

  - Willingness to work in shifts or on-call support when needed. 

  - Willing to travel for supplier audits, FAT/SAT, or benchmarking visits. 

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.