Molding Process and Equipment Engineer

Nexperia is a world-class company in semiconductor development and in-house production. We form a global network of talent, with passion and performance, perseverance and professionalism. Join TeamNexperia and become part of a leading company that supports, rewards and challenges you equally, in a dynamic environment, working for world-class results. Talk to us today and learn your true capabilities in an energetic company where you will develop and thrive, the Efficiency Company – Nexperia.

Qualifications

Bachelor's degree in any engineering discipline.

Minimum 5 years of experience in the semiconductor industry, with at least 3 years specializing in EMC molding.

Proven hands-on expertise in compression or transfer molding processes, including thin flat mold, exposed pad, and multi-die molding.

Proficient in statistical analysis tools such as JMP and Minitab, and skilled in technical documentation.

Deep understanding of mold compound properties, material flow dynamics, curing behavior, and interactions with other assembly materials will be added advantage.

Key Responsibilities

Lead the maintenance and continuous improvement of molding equipment across diverse package types.

Equipment down-time (DT) monitoring and mitigation planning (MTBF/MTBA), regularly assess the effectiveness of scheduled DT activities, ensuring verification and buy-off processes meet equipment specifications and performance standards.

Partner with the process engineering team to validate new product designs during development and qualification phases for high-volume manufacturing (HVM).

Collaborate with cross-functional teams to maintain and update technical documentation such as control plans, process specifications, SOPs, technical reports, and FMEAs.

Plan technician headcount coverage to support 24/7 operations, delegate tasks effectively, and provide consistent transparency updates.

Mentor and coach technicians to strengthen engineering competencies and mindset, including setting KPIs and conducting annual performance reviews.

Collaborates with R&D, NPI, product design, and reliability teams to align molding equipment capabilities with package architecture and process requirements.

Diagnose and resolve molding-related defects.

Facilitate seamless technology, process, and equipment transfers and ramp-ups to HVM.

Contribute to the development of process technology roadmaps for advanced packaging, thin form factors, and emerging device architectures.

Actively participate in improvement initiatives such as MVA, yield enhancement, and UPH optimization.

Manage spare parts inventory and procurement activities.

Liaise with suppliers and vendors for jig and fixture orders and closely monitor delivery timelines for both spare and non-spare items.

Thrive in a dynamic, fast-paced manufacturing environment.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.