Senior Engineer

15 hours ago

Seremban, Negeri Sembilan, Malaysia Nexperia Germany GmbH Full time 80,000 - 120,000 per year

About the Role

As a Senior Engineer specializing in Die Attach and Clip Attach (DACA) processes, you will lead the development, optimization, and qualification of advanced semiconductor packaging technologies. You will collaborate closely with cross-functional teams to ensure manufacturability, reliability, and cost-effectiveness of new package designs from concept through high-volume production.

What You Will Do

Process Development & Optimization

  • Develop and sustain die attach and clip attach processes for new and existing semiconductor packages.
  • Lead material and equipment evaluations to enhance process robustness, yield, and throughput.
  • Drive continuous improvement in process capability, equipment utilization, and cost efficiency.
  • Perform root cause analysis and implement corrective and preventive actions (CAPA) for yield or quality issues.
  • Define and maintain process documentation, including control plans, specifications, and FMEAs.

New Product Introduction (NPI)

  • Collaborate with R&D, Product Design, and NPI teams to translate new package designs into manufacturable solutions.
  • Support prototype builds, process characterization, and qualification runs.
  • Establish process parameters and guidelines to ensure smooth transition to high-volume manufacturing (HVM).

Cross-Functional Collaboration

  • Partner with Equipment and Manufacturing Engineering teams to define and validate tooling, machine capability, and process windows.
  • Work with Quality and Reliability teams to ensure compliance with internal and customer standards.
  • Provide technical guidance and training to process engineers and technicians.

Continuous Improvement

  • Lead Manufacturing Value Add (MVA), cost reduction, and yield improvement projects.
  • Evaluate new technologies and methodologies to enhance process performance and scalability.

What You Will Need

  • Bachelor's or Master's Degree in Mechanical, Electrical, Electronics, Materials, or related Engineering field.
  • Minimum 5 years of experience in semiconductor assembly, specifically in Die Attach / Clip Attach processes.
  • Strong hands-on experience with epoxy, sinter, eutectic, and solder attach technologies.
  • Knowledge of process control, DOE, FMEA, and statistical analysis (SPC, Minitab).
  • Experience in equipment and material qualification and NPI transfer to mass production.
  • Excellent analytical, troubleshooting, and communication skills.
  • Able to work independently in a fast-paced, cross-functional environment.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

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