Senior Sales Engineer or Assist. Sales Manager

5 hours ago


Penang, Malaysia Topscience (S) Pte Ltd Full time 120,000 - 240,000 per year

Company Overview:

We are a trading company specializing in the distribution of semiconductor products. We are seeking a motivated and experienced Senior / Sales Engineer with a strong background in the semiconductor industry, particularly in backend packaging & assembly processes, and experience engaging with Foundries, OSATs and IDMs. This role plays a key part in driving business growth, developing customer relationships, and achieving sales targets.

Key Responsibilities:

  • Develop and execute comprehensive sales and business development strategies to expand market presence and meet sales targets for Foundries, OSAT and IDMs
  • Identify and prospect potential clients across Foundries, OSAT and IDMs within the semiconductor industry.
  • Build and maintain strong relationships with key decision-makers and stakeholders, ensuring high levels of customer satisfaction and loyalty.
  • Understand client needs, market trends, and the competitive landscape to effectively position our products and solutions.
  • Conduct market research and analyze customer requirements to provide feedback and insights to internal teams for product enhancement.
  • Prepare and present sales forecasts, budgets, and performance reports to senior management, highlighting key trends and growth opportunities.
  • Negotiate contracts, pricing, and terms with customers to ensure profitability and compliance with company policies.
  • Stay abreast of industry advancements, market dynamics, and emerging technologies, especially in backend packaging/assembly and foundries manufacturing processes.

Requirements:

  • Diploma or Bachelor's Degree in Engineering or a related field.
  • Experience in the semiconductor industry, including Foundries, OSATs and IDMs, is preferred.
  • Strong understanding of Foundries, OSATs and Semiconductor Products—especially backend packaging processes and various types of traditional and advanced packaging such as 2.5D/3D Packaging, Fan-Out Wafer Level Packaging (FOWLP), System-in-Package (SiP), and Embedded Die Packaging—is an advantage.
  • Established network and relationships with semiconductor clients and industry professionals—particularly across OSAT, Foundry, and IDM sectors—are highly desirable.
  • Proven sales, negotiation, and communication skills.
  • Ability to understand and articulate technical concepts clearly to customers.
  • Excellent interpersonal skills, with a strong customer-oriented mindset.
  • Self-motivated, results-driven, and proactive in achieving business objectives.


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