Senior/Staff Assembly Equipment Engineer

Found in: Talent MY C2 - 1 week ago

Johor Bahru, Malaysia Micron Full time

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR46613 Senior/Staff Assembly Equipment Engineer (Encapsulation/Molding)

As a Senior/Staff Equipment Engineer, you will be leading a group of engineers who are responsible for the equipment used in the manufacturing process. You will ensure that the equipment is installed, modified, upgraded, and maintained properly to meet the production requirements and quality standards. You will also analyze the equipment performance and reliability data to identify and implement improvement opportunities. You will work with vendors to qualify alternative sources of equipment and reduce costs. You will manage the equipment risk effectively and proactively develop new capabilities to meet future needs.

Responsibilities and Tasks: 
• Implement a preventive/predictive maintenance program.
• Develop equipment maintenance specifications.
• Monitor equipment performance key indicators and be responsible for meeting expectations.
• Provide vital production support.
• Establish a spare inventory system for key equipment
• Supervise spare cost and drive down liabilities of spare inventories
• Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
• Identify the key cost drivers and work on cost-reduction programs
• Define, develop, and maintain equipment capabilities, strategy, and roadmap
• Maintaining a matrix of equipment capabilities and constraints
• Work with equipment suppliers to develop new material/capabilities
• Regularly conduct equipment benchmarking exercise
• Work with Package Development team to establish production capabilities for new products
 

Requirements:
• Master / Degree or equivalent experience in Mechanical, Mechatronics, Electrical & Electronics or related Engineering 
• Excellent interpersonal, communication, and leadership skills with positive attitude towards working as a team.
• In-depth knowledge and extensive experience with Encapsulation and Post Encapsulation processes Molding, Post Mold Cure, Singulation, Solder Ball Placement, Laser Marker, AOST, SMT.
• Serves as a domain expert within the technical field.
• Working experience > 8 years.
• Experience with multi-stack die process challenge.
• APC data analytics knowhow.
• Ability to work independently with a minimum of day-to-day supervision.
• Experience with team leadership or supervising senior/junior engineers and technicians.
• Able to work in a multi-functional team and under the pressure of multiple priorities, for example with NPI, MFG, and process teams.
• Past white paper/technical paper or active patents will be an added advantage.

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