Senior Package Reliability Engineer

3 weeks ago

Malaysia Micron Full time
Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever.

JR46389 Senior Package Reliability Engineer

As a GQ (Global Quality) Package Reliability Engineer in the Product Quality and Reliability Assurance team at Micron Technology Inc., the main responsibility is package quality and reliability for one of Micron's product lines.

Responsibilities and Tasks:
  1. Lead Regulation for New Product Qualifications
  2. Coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced
  3. Provide comprehensive qualification plans for new developments
  4. Provide recommendations on product release based on package reliability test results
  5. Design and Implement Reliability Test Plans
  6. Devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues
  7. Provide advice for accurate screen method for quality concerned lots
  8. Sustain appropriate monitoring methodology for quality
  9. Regulate Root Cause and Corrective Action Plans
  10. Lead 8D report processes
  11. Coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers)
  12. Prepare reports for discussion with partners
  13. Act as a liaison for both Internal and External Customers
  14. Evaluate whether internal and external customer requests are reasonable and acceptable for Micron quality policy
  15. Provide technical support for package-related quality and reliability issues
  16. Supply technical expertise for customer requests
  17. For senior position: Leading other engineers to achieve goals of team
  18. Provide advice and guidance to other engineers, mentor, and develop talent
Requirements:

Education: Background of a min Bachelor's Degree in Electronics, Material Science, Mechanical, or equivalent experience
Detailed knowledge of:

  • semiconductor component package assembly processes and challenges
  • surface mount processes and challenges
  • mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
  • effects of thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability
  • industry standard reliability test methods of package level and board level, acceleration models used for life predictions, and sampling statistics preferred
Skills:
  • Self-motivated, able to work independently, and detail-oriented
  • Strong analytical problem-solving skills, excellent multi-tasking skills, and the ability to interact easily with other groups
  • Good written and verbal communication skills in English and digital literacy are vital
  • Ability for other Asian languages, especially Chinese and Japanese, can be a plus
  • Understanding of the software systems employed in backend manufacturing
  • Understanding of statistics and quality management (SPC, FMEA, 8D CAR, etc.)
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