Mold Process Staff Engineer

4 weeks ago

George Town, Penang, Malaysia ASE Full time
Job Responsibilities
  • Determine production plan & organize all production activities.
  • Plan production run based on Production Schedule and forecast Schedule with Manpower.
  • Review daily production performance on Output, Yield, Quality, and Productivity with subordinates.
  • Liaise with ME, QC, PCMC, and other related departments on outstanding issues.
  • Ensure the department reaches the targeted on-time delivery (OTD) with optimum cycle time while maintaining quality.
Requirements
  • Degree in Electrical Electronics / Mechanical / Mechatronic & Industrial Engineering.
  • Minimum of 3 years of experience.
Job Responsibilities
  • Optimize existing programs in AOI area, ensuring all processes are running within specified quality targets.
  • Support for New Product Introduction.
  • Monitor and maintain machines to acceptable standards.
  • Monitor and conduct yield and quality analysis and initiate improvement activities.
Test Process EngineerRequirements
  • Degree in Electronics / Mechanical or Industrial Engineering.
  • 1 to 3 years of experience.
Job Responsibilities
  • Establish optimum test process and prepare standard operation procedures.
  • Enhance in-process quality and process abnormality management.
  • Review process control & introduce improvements or process simplification to increase productivity & better process control.
  • Monitor yield & initiate yield improvement projects to reduce yield loss & improve quality.
  • Support customer or internal requests on engineering activities / evaluation.
Requirements
  • Degree in Electronics / Electrical / Mechanical Engineering.
  • Min 3 years in semiconductor industry in the field of assembly engineering.
  • Good knowledge of FMEA, DOE, SPEC, and risk analysis.
  • Independent with good communication skills and ability to work effectively in a cross-functional environment with people at all levels.
Job Responsibilities
  • Responsible for process ownership of Die Attach machine in the assembly line.
  • Establish and set up new die attach assembly process capabilities and materials including hands-on equipment setup.
  • Monitor performance, quality, and reliability of the die attach process. Identify problems, recommend, and implement corrective and preventive actions.
  • Support engineering build requests, ramp-ups, and platform extensions.
  • Monitor and improve the yield of the die attach process, including cost reduction activities.
Requirements
  • Degree in Electrical Electronics Engineering.
  • 1-3 years of working experience in the related field.
  • Strong analytical, problem-solving, decision-making, planning, and organizing skills.
  • Work with common test equipment (oscilloscope, spectrum analyzer, time interval analyzer, logic analyzer, network analyzer). Experience with ATE test platforms.
Job Responsibilities
  • Test Support for semiconductor packages (Power, RF, Amplifier, SOC, etc.) online down issues related to product-related failures such as low yields, high rejects, failures validation, wafer issues, reports, downtime, etc.
  • Support new device transfer and coordinate release products for mass production.
  • Involve in yield improvement projects, semiconductor package level improvements.
  • Understand the line issue and work with customers for product level improvements.
  • Create data-oriented results and statistical results for analysis which leads to work on problem statements and possible root causes.
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