Principal Engineer, Packaging Engineering

3 weeks ago

Butterworth, Penang, Malaysia SanDisk Full time
  • Full-time
  • Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
  • Business Function: Packaging Engineering
Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

Process Development owner at BOPProcess such as Package saw/ Laser mark/ Solder ball attached- SBA/UBA & EMI etc.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Define the process window and recipe baseline by using JMP DOE approach.
  • Good in problem solving and work on the Root Cause Analysis/Finding using, 5 whys, DMAIC, 8D approach/methodology.
  • Work closely with Cross site's Package development team to understand the Package Design Rules & Requirements.
  • Ensure smooth transition from Development to new product qualification phase.
  • Work closely with manufacturing process and equipment team, and cross site process development team.
  • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
  • Ensure effective handshake/pass over of process for New device/product introduction to the production line and new process technology capabilities development.
  • Responsible for new material/component first article inspection and final buyoff.
  • Continuous improvement on direct/indirect material/UPH cost down & yield enhancement program.
  • Ensure robustness of process control to meet yield & through-put expectation.
  • Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.
Qualifications

REQUIRED:

  • Min Bachelor or higher Engineering degree (Material/Mechanical/Mechatronics, Physics & etc).

PREFERRED:

  • Hands on personality – production line focus personnel.
  • Good project planning, strong sense of quality and urgency.
  • Team player with good communication and interpersonal skills.

SKILLS:

  • JMP/Six Sigma/AutoCAD.
Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [emailprotected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk's behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [emailprotected].

#J-18808-Ljbffr

  • Principal NAND Engineer for Reliability

    5 days ago

    Butterworth, Penang, Malaysia Micron Technology, Inc Full time

    Micron Technology, Inc. is an industry leader in memory and storage solutions.We are seeking a skilled NAND Product Reliability Principal Engineer to drive innovation and excellence in our reliability program.The successful candidate will have a strong background in electrical engineering, experience in reliability testing, and excellent analytical...

  • Engineer, Packaging Engineering

    3 weeks ago

    Butterworth, Penang, Malaysia Sandisk Full time

    [FRESH GRAD ONLY - Intake July 2025 onwards] Engineer, Packaging EngineeringFull-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Packaging EngineeringSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's...

  • Senior Packaging Engineer

    5 days ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Job DescriptionWe are seeking a highly skilled and experienced Packaging Engineering Lead to join our team at Sandisk. In this role, you will be responsible for leading the development and implementation of packaging solutions for our semiconductor products.The ideal candidate will have a strong background in mechanical engineering and process development,...

  • Senior Engineer, Packaging Engineering

    3 weeks ago

    Butterworth, Penang, Malaysia SanDisk Full time

    Business Function: Packaging EngineeringCompany DescriptionSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating...

  • Principal Engineer

    4 weeks ago

    Butterworth, Penang, Malaysia Micron Technology, Inc Full time

    Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.As a NAND Product Reliability Principal Engineer, you will...

  • Senior Engineer, Packaging Engineering

    4 days ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Company DescriptionSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in...

  • Staff Engineer, Packaging Engineering

    4 days ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Staff Engineer, Packaging Engineering (Technology Development Quality & Reliability)Company DescriptionSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory...

  • Packaging Engineering Team Lead

    5 days ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Job OverviewSandisk is a leading innovator in Flash and advanced memory technologies, shaping the digital world through our solutions. As a Senior Manager, Packaging Engineering, you will play a crucial role in driving the development of best-in-class material solutions for top-edge products.Key ResponsibilitiesDevelop a packaging material roadmap to support...

  • Package Engineering Team Lead

    2 weeks ago

    Butterworth, Penang, Malaysia SanDisk Full time

    Package Engineering Team Lead - Quality and ReliabilityJob DescriptionWe are seeking an experienced Package Engineering Team Lead to drive quality and reliability initiatives in our semiconductor packaging operations. The ideal candidate will have a proven track record of leading high-performing teams and driving quality excellence.Key Responsibilities:Lead...

  • Senior Packaging Solutions Engineer

    4 days ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Role OverviewWe are seeking a highly skilled Senior Packaging Solutions Engineer to lead our SiP integration efforts. As part of our packaging engineering group, you will be responsible for developing and qualifying new SiP products from concept design to mass production.

  • Packaging Materials and Processes Expert

    7 days ago

    Butterworth, Penang, Malaysia SanDisk Full time

    Join Our TeamWe're looking for a talented Principal Engineer, Packaging Engineering to join our dynamic team. As a key member of our packaging engineering group, you'll develop and implement processes for packaging engineering, ensuring compliance with company standards and regulations.ResponsibilitiesDevelop process windows and recipe baselines.Analyze and...

  • Senior Engineer, Packaging Engineering

    4 weeks ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can create what's next. To fulfill our vision, we are always on the lookout for potential team members who share our passion for solving problems to empower others.When you join Western Digital, you join a legacy more...

  • Senior Semiconductor Packaging Engineer

    2 weeks ago

    Butterworth, Penang, Malaysia SanDisk Full time

    SanDisk Staff Engineer, Technology Development Quality & Reliability EngineeringCompany OverviewWe design, manufacture, and deliver innovative flash storage solutions that empower people to push the boundaries of what is possible. Our relentless pursuit of innovation enables us to stay ahead of the curve in a rapidly changing digital landscape.Our commitment...

  • Engineering Lead for Advanced Packages

    4 days ago

    Butterworth, Penang, Malaysia Sandisk Full time

    RequirementsTo be successful in this role, you will need a Master's degree in Material Science, Polymer Science, Mechanical Engineering, or other relevant engineering disciplines. A Bachelor's degree with minimum 2 years of relevant work experience will also be considered.You should have proficient understanding of packaging domains, including semiconductor...

  • Senior Packaging Engineer Lead

    1 week ago

    Butterworth, Penang, Malaysia SanDisk Full time

    OverviewSandisk is a world-renowned leader in the development of innovative flash memory solutions. Our company's rich history of groundbreaking innovations has enabled us to deliver solutions that meet the needs of today and tomorrow.We understand the importance of data consumption and how it affects people and businesses. As such, we relentlessly innovate...

  • Staff Engineer, Packaging Engineering

    6 days ago

    Butterworth, Penang, Malaysia Sandisk Full time

    2 days ago Be among the first 25 applicantsGet AI-powered advice on this job and more exclusive features.Company DescriptionSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and...

  • Staff Engineer, Packaging Engineering

    4 weeks ago

    Butterworth, Penang, Malaysia SanDisk Full time

    Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Packaging EngineeringCompany DescriptionSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of...

  • Senior Manager, Packaging Engineering

    2 weeks ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Company OverviewSandisk is a company of problem solvers. People achieve extraordinary things given the right technology.We are a key partner to some of the largest and highest growth organizations in the world. From energizing competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering data centers...

  • Senior Packaging Engineer

    3 weeks ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Company DescriptionSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in...

  • Senior Manager, Packaging Engineering

    2 weeks ago

    Butterworth, Penang, Malaysia Sandisk Full time

    Company DescriptionAt Sandisk, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.At our core, Sandisk is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we've been doing just that. Our technology helped people put a...