Pgdm Module Equipment Technician

1 week ago


Penang, Malaysia INTEL Full time

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for over five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Module Equipment Technicians perform functions associated with all Advanced Packaging production including operations, equipment, process, and training. Responsibilities may include, but are not limited to: Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process start-up to high volume manufacturing. Partnering with the production team to deliver world-class performance on critical success indicators (Safety, Quality, Output and Equipment performance) in a highly automated production facility. Perform plan preventive maintenance and other operational tasks on assigned equipment and process in 12 hours shift pattern Perform 1st level troubleshooting, containment actions and reporting documentation on equipment/process stability issue in production line Works with Engineers to support new equipment installations, sustaining, and process improvement initiatives Train and certify junior technician

**Qualifications**:
**Inside this Business Group**:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

**Posting Statement**:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

**Benefits**:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

**Working Model**:
This role will require an on-site presence.

JobType

On-site Required



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