Technician 3, Lab

3 days ago


Sentul, Malaysia Western Digital Full time

Job Description
- Perform failure analysis on assembly and test defect from packaging development and production and qualification on finished products (SSD).
- Read and understand the test data log.
- Have hands-on experience performing physical failure analysis using FA tools such as X-ray, high and low microscope, SEM, EDX, TDR, Dye and Pry analysis and cross-sectioning etc.
- Generate FA report and assist engineer for root-causing of defect/s. Maintain the FA tracking sheet and FA equipment PM.

**Qualifications**:

- Diploma in electronics/ electrical engineering. Electrical background with adequate knowledge on semiconductor assembly process and technology
- At least 3 years FA hands-on experience on component or drivel level failure analysis
- Understand failure analysis methodology and flow such as 2D/3D X-ray, SEM/EDX, Dye and Pry Analysis, Package Cross-Section Analysis.
- Good communication skills
- Quick learning ability
- Decent English reading and writing skills.
- Good communication and presentation skills
- Good teamwork spirit
- Competent in technical FA report writing
- Previous electrical FA experience in IC or memory devices is a plus.

Additional Information

All your information will be kept confidential according to EEO guidelines.


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