Pgdm Foveros Transfer Manager
3 weeks ago
Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products.
To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.
This role is highly dynamic and pivots across multiple facets of the factory organization (i.e., TD, Module, construction, yield, support, finance, Corporate Services, Supply Chain, etc.). This role requires a highly motivated and engaged individual with strong leadership capabilities to be the conduit between the transfer location (New Mexico/TD) and the receiving site (Malaysia). Strong communication/organization skills and partnership will be key to this role. The individual in this role will have to maintain strong alignment with both sites and provide direct guidance to enable a successful start-up and transfer to the new receiving site.
As the Technology Transfer Manager, you will be responsible for but not limited to:
- Define the start-up methodology and execution plan to lead to a successful ramp start
- Define and align the Foveros transfer requirement with the transfer sites and execute the plan to meet the ERS timeline
- Review, document, and disposition of CE deviation with key stakeholders through the rightful forums
- Define CERT risk and drive closure to the risk matrix
- Collaborate with Schedule Team on setting priorities for segment startup for Foveros process
- Work across factories to ensure a successful startup for the Foveros process
- Leadership.
- Is proactive and highly self-motivated.
- Demonstration of critical thinking and strong attention to detail.
- Skilled to analyze complex situations, and distilling critical issues for senior management.
- Demonstrated strong communication skills to manage stakeholders across multiple organizational levels, functional areas, and geographies.
- Skilled in providing guidance, mentorship, and making connections across a program.
- High tolerance for ambiguity and demonstrated flexibility and adaptability in a fast-changing environment
- Independent and highly accountable individual that is comfortable challenging the status quo, uncovering critical help needed items, and driving resolution to key issues that may arise.
- Demonstrated a track record of problem-solving with creativity and out-of-box thinking as well as future, strategic, and possibility thinking.
This posting will require an onsite assignment in Malaysia.
**Qualifications**:
Minimum Qualifications:
- 6+ years of experience with:
- Technology Transfer in either a host or receiving site role
- Leadership responsibilities (e.g. facilitating cross-organization meetings, working groups, taskforces, managing indicators, facilitating) with demonstrated ability to drive projects to successful completion
- Mentoring others on resolving gap-to-goal issues
- Managed direct and matrixed transfer teams of engineers/technicians during technology transfer training assignments
- Transfer of technology or process to volume production with experience in New Process and Product Introduction
- 6+ years of background in Fab Process Engineering, Wafer Level Packaging or Assembly Processes
- Position not eligible for Intel Immigration sponsorship.
Preferred Qualifications:
- Practical understanding of fab/factory facilities and their impact on the wafer and packaging process
- Direct experience with Quality and Reliability certification procedures and criteria
- Experience with various equipment and toolsets for wafer level packaging and metrology
**Inside this Business Group**:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
**Posting Statement**:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or or
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