Electronics Equipment Specialist

4 days ago


Kuala Lumpur, Kuala Lumpur, Malaysia NXP Semiconductors Full time
Job Description

We are seeking a skilled Electronics Equipment Specialist to join our team at NXP Semiconductors. As an Electronics Equipment Specialist, you will be responsible for managing wire bond and AOI equipment.

Key Responsibilities:
  • Manage BGA - Equipment Engineer managing wire bond and WB AOI equipment.
  • Drive the performance of Wire Bonder & WB AOI Machines to meet quality product, output, and cycle time targets.
  • Collaborate with API and NPI teams on new product equipment setup and buy-off.
  • Lead a team of wire bond technicians to maintain machine performance through preventive maintenance and predictive maintenance.
  • Monitor equipment indices and improvement plans to continue improving machine Downtime/MTBA/PM success rate.
  • Investigate equipment-incurred quality incidents and implement CAPAs.
  • Be responsible for new bonder, new software installation, buy-off, and qualification.
  • Release and update equipment-related documents (WI, ERA, PM, etc.).
  • Participate in all quality audits (GMA, IATF, customers) and 5S audits.
  • Support department automation projects at wire bonder and AOI machines.


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