Product Engineering Lead

3 days ago


Ipoh, Perak, Malaysia Infineon Technologies Full time
Job Description

This role oversees the engineering area in Back-end Subcon, focusing on product yield, quality, and continuous improvement. The ideal candidate will possess a strong background in semiconductor engineering, data analysis tools, and FE/assembly process knowledge.

The selected individual will:
  • Take ownership of product/package yield/quality and drive for continuous improvement.
  • Interface with IFX product engineering in Unisem Chengdu.
  • Be the first point of contact for product engineering topics and escalations by subcon.

Responsibilities:

The responsibilities of this role include in-depth analysis of product (Design/FE), assembly, and test-related issues. This involves driving feedback to relevant parties for continuous improvement. The candidate must be familiar with data analysis tools and grasp deep analysis to reflect actual production performance.

The position requires coordinating improvement activities between FE/Assy/Test/Customer. The ideal candidate should have knowledge of FE fab/assembly process and master in the test area. Additionally, they should be able to dig out potential root causes between FE/Assy and testing areas if encountered during production.

New Product Ramp Team Member:

This role is part of the New Product Ramp team and manages safe launch. The candidate will drive new subcon enabling (technical & Supply Chain & IT) and assess and implement product changes/transfers, including training to the subcon engineering.

The successful candidate will also support test-related topics in PCRB, project milestones, and collaborate with other stakeholders (planning/quality/subcons/etc.) to ensure product health meets IFX requirements in terms of yield/quality/cycle time/delivery/etc.

Documentation Management:

The selected individual will manage test-related documentation, reviewing and updating control plans and test procedures to align with IFX requirements. This includes managing test procedures and specs, product change notices (PCN), engineering change notices (ECN), quality systems, and test data transfer from subcon to EBS.

FAR Activities:

This role independently handles FAR activities, including analysis of root cause and improvement actions in subcon.

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