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Lead Frame/Substrate Packaging Expert

1 week ago

Malacca City, Malaysia Infineon Technologies Full time
About the Role

We are looking for an experienced Lead Frame/Substrate Packaging Expert to join our team.

Key Responsibilities:
  • Design, develop, and implement lead frame and substrate solutions that meet customer requirements.
  • Collaborate with cross-functional teams to ensure effective communication and issue resolution.
  • Provide technical guidance and support to internal stakeholders on lead frame and substrate-related topics.
  • Conduct feasibility studies and provide recommendations on lead frame and substrate designs.
  • Work closely with suppliers to ensure timely delivery of high-quality lead frames and substrates.
Requirements
  • Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
  • 5+ years of experience in semiconductor assembly and packaging development; lead frame/substrate/packing material experience is preferred.
  • Strong knowledge of lead frame and substrate design principles and materials science.
  • Experience with CAD tools, such as AutoCAD or Inventor.
  • Excellent communication and interpersonal skills.
  • Able to work in a fast-paced environment and prioritize tasks effectively.