Staff Engineer Unit Process Development Wire Bond

2 days ago

Malacca City, Malaysia Infineon Full time 100,000 - 120,000 per year

Perform process development activities (Parameter scouting, Optimization, Verification, Process Freeze, Qualification, Safe launch) to meet project targets in term of timeline, quality, cost and manufacturability. Responsible for technical handshake and knowledge transfer to operation. Generate and update relevant documents, example Process development record (PDR), Process specification, PFMEA, DFMEA, OJTI, T32. Provide inputs for updating of related documents and responsible for their correct contents, e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance check list, etc. for development projects. Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in development projects. Participate and support problem solving team using statistical and analytical tools, e.g. SPC, APC, DOE, 8D, FMEA, DFMEA. Identify and develop new process technology and improve process capability to meet new requirements from business divisions. More than 5 years working experience in wire bonding process development. Knowledge in ball bonding at wire bonder platform such as Shinkawa and ASM. Experience in Font of Line vision inspection stay advantage. Knowledge on statistical analysis software such as JMP, CEDA, Minitab. Good teamwork and approachable. Always striving for excellence in the tasks given. Innovative and creative. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

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