Technologist, Product Development Engineering

ESSENTIAL DUTIES AND RESPONSIBILITIES:

Product Development Team will be responsible for respective Memory (NAND)  product Development activities in relation to NPI Product Test Development. Scope of engineering work encompasses following:

• Participates in designing a complete comprehensive framework of Functional Product Test Plan for any specific Wafer, Memory & System product (PCIe).
• Participates in designing processes for technical platforms, system specifications, input/output and working parameters for hardware and/or software compatibility particularly in the wafer specifications and test flow.
• Conceives system interfaces and business application prototypes. Identifies, analyzes and resolves system design weaknesses. Understanding on wafter test systems and process is must.
• Failure analysis on qualification failures
• Influences the shaping of future products by contributing to the framework (architecture) used across multiple products or systems.
• Participates in designing, developing, and implementing effective methods of testing and troubleshooting systems and equipment for NPI phases of product development and manufacturing, particularly in wafer DS, Wafer Level Burn-in tests.
• Provides multi-layered technical expertise for next generation initiatives.
• Prepares test and diagnostic programs, designs test fixtures and equipment, and completes specifications and procedures for new products.
• Plans the labor, schedules, and equipment required for testing and evaluating standard and special devices.
• Participates in evaluating test strategy to best fit the quality-of-test for new product
• Develops Product characterization parameters by using test platform or instrumentation
• Performs analytical study by using statistical tools – SPC/MiniTab/JMP, conduct FMEA, custom DOE, prepare and liaise with other support Engineering groups for efficient manufacturing test platform
• Analyzing, troubleshooting and fixing issues discovered by internal test teams or by customer use of the products.
• Representing the team in one or more multi-disciplined engineering core team(s).

Required:

• PhD/MSc/MEng/Degree in E&E or Telecommunication.
• Minimum 5+ Years of experience in Product Engineering/Failure analysis & Semiconductor IC
• Experience in semiconductor wafer testing methods, test blocks, test systems including Die Sort, Wafer level burn-in tests is must.

Skills:

• Candidates with deep electronics knowledge will have advantage.

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