Process Engineer
2 days ago
Company Description
Unisem is a global provider of semiconductor assembly and test (OSAT) services for leading electronics companies. We offer packaging and test services such as wafer bumping, wafer probing, wafer grinding, and a range of leadframe and substrate IC packaging. Unisem is experienced in volume consumer and automotive production and has a comprehensive package portfolio covering various applications. The company has factory locations in Simpang Pulai and Gopeng, Perak, Malaysia; and Chengdu, China.
Role Description
- Provide technical support and solutions to resolve critical issues in the assembly line.
- Preferably possess experience in Flip Chip, SMT and Backgrind processes.
- Ensure all processes comply with Standard Operating Procedures (SOPs).
- Continuously monitor performance at QA gates, SPC, and yield metrics.
- Conduct process optimization through Design of Experiments (DOE) and machine capability studies.
- Perform verification and analysis on defective parts to identify root causes and implement corrective actions.
Qualifications
- Bachelor's Degree in Electrical & Electronic Engineering, Mechanical Engineering, or an equivalent discipline.
- Preferably 2 to 5 years of experience in the semiconductor industry with similar job responsibilities.
- Knowledge of Design of Experiments (DOE) and Statistical Process Control (SPC) is an advantage.
- Must be independent, self-motivated, and able to work with minimal supervision.
- Possess strong analytical, communication, and interpersonal skills.
- Ability to communicate in Mandarin is an added advantage.
- Fresh graduates are encouraged to apply.
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