Process Engineer

2 days ago


Ipoh, Perak, Malaysia Unisem Full time 80,000 - 120,000 per year

Company Description

Unisem is a global provider of semiconductor assembly and test (OSAT) services for leading electronics companies. We offer packaging and test services such as wafer bumping, wafer probing, wafer grinding, and a range of leadframe and substrate IC packaging. Unisem is experienced in volume consumer and automotive production and has a comprehensive package portfolio covering various applications. The company has factory locations in Simpang Pulai and Gopeng, Perak, Malaysia; and Chengdu, China.

Role Description

  • Provide technical support and solutions to resolve critical issues in the assembly line.
  • Preferably possess experience in Flip Chip, SMT and Backgrind processes.
  • Ensure all processes comply with Standard Operating Procedures (SOPs).
  • Continuously monitor performance at QA gates, SPC, and yield metrics.
  • Conduct process optimization through Design of Experiments (DOE) and machine capability studies.
  • Perform verification and analysis on defective parts to identify root causes and implement corrective actions.

Qualifications

  • Bachelor's Degree in Electrical & Electronic Engineering, Mechanical Engineering, or an equivalent discipline.
  • Preferably 2 to 5 years of experience in the semiconductor industry with similar job responsibilities.
  • Knowledge of Design of Experiments (DOE) and Statistical Process Control (SPC) is an advantage.
  • Must be independent, self-motivated, and able to work with minimal supervision.
  • Possess strong analytical, communication, and interpersonal skills.
  • Ability to communicate in Mandarin is an added advantage.
  • Fresh graduates are encouraged to apply.


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