Software Engineering Manager

Key Responsibilities and Duties:

1. Strategic & Technical Leadership

• Define the software and control technology roadmap supporting advanced packaging processes such as underfill jetting, TIM dispensing, flip-chip, chiplet-to-interposer bonding, and wafer-to-wafer hybrid integration.
• Lead multi-disciplinary teams in software architecture, motion control, computer vision, and data analytics for high-precision automation platforms.
• Align software development priorities with corporate R&D goals in sub-10-micron EHD jetting and multi-nozzle MEMS printhead systems.
• Mentor and grow a high-performing team of software engineers capable of supporting complex mechatronic and process-driven systems.

2. Software Architecture & System Integration

• Architect modular, scalable, and reusable software frameworks that unify motion, vision, jetting, and AI feedback across NSW product lines.
• Ensure deterministic real-time control for multi-axis motion, synchronized jetting, and droplet metrology with sub micron accuracy.
• Lead integration of process modules such as flux cleaning, plasma, curing, and inspection into unified automation platforms.
• Oversee communication layer design using EtherCAT, OPC-UA, Modbus, and proprietary protocols to ensure interoperability across machine subsystems.

3. Product Development & Execution

• Translate semiconductor and packaging process requirements into executable software deliverables.
• Oversee the development of intuitive HMIs, data logging, recipe management, and closed-loop control systems.
• Manage concurrent software projects supporting new product introductions and customer-specific customizations.
• Collaborate with process, mechanical, and electrical engineering teams to ensure cohesive system performance and manufacturability.
• Drive joint-development projects with OEMs, controller vendors, and automation partners to accelerate system integration and feature enhancement.

4. Advanced Packaging Process Enablement

• Work closely with process and customer to implement AI/ML algorithms for related process control.
• Lead software development for inline inspection and metrology systems (vision-based droplet detection, alignment correction, defect mapping).
• Support new applications in fan-out wafer-level packaging (FOWLP), chiplet integration, and advanced underfill through software-driven process control.
• Guide the digital transformation of equipment integrating MES/SECS-GEM, traceability, and predictive maintenance capabilities.

5. Innovation, Quality & Compliance

• Drive continuous improvement in software lifecycle, validation, and risk control and SEMI standards.
• Establish robust testing frameworks, regression validation, and field-upgrade systems to ensure uptime and process reliability.
• Promote a culture of innovation and intellectual property generation through advanced algorithms, control logic, and UI/UX innovations.

Job Requirement

• Bachelor's or Master's degree in Software Engineering, Mechatronics, Electrical Engineering, or Computer Science.
• 10–15 years of software engineering experience in semiconductor equipment, advanced packaging, or high-precision automation.
• Proven track record in real-time control, motion systems, or precision robotics for wafer-level or die-level processes.
• At least 5 years in a managerial or senior leadership role, leading cross-disciplinary software teams.
• Hands-on experience integrating motion controllers, vision systems and dispensing/jetting subsystems.
• Familiarity with semiconductor manufacturing standards (SEMI E30 GEM, SECS/GEM, E142 substrate mapping) and data protocols.
• Strong expertise in C#, C++, .NET/WPF, and Python.

Job Type: Full-time

Pay: RM8, RM12,000.00 per month

Benefits:

• Dental insurance
• Free parking
• Health insurance
• Opportunities for promotion
• Vision insurance

Application Question(s):

• How long is your notice period?

Education:

• Bachelor's (Required)

Language:

• Mandarin? (Required)

Work Location: In person