Engineers (Process, Mechanical, Test) - Die attach & wire bond

6 hours ago

Butterworth, Penang, Malaysia NationGate Solution (M) Sdn Bhd Full time

Job responsibilities:

  1. Process Engineer

  2. Support daily manufacturing operations to ensure process yield, quality, and on-time delivery (OTD) performance.

  3. Reviewing, optimizing, and maintaining assembly and manufacturing processes to improve manufacturability and efficiency.
  4. Participate in process qualification, tooling verification, and product transfer activities.
  5. Create, update, and maintain process documentation, including process specifications, visual aids, manufacturing routes, and work instructions.
  6. Support continuous improvement initiatives focusing on yield improvement, cost reduction, and process simplification or automation.
  7. Assist in identifying and analyzing process and material-related quality issues, and support corrective and preventive actions (CAPA).

  8. Perform basic GR&R, correlation studies, and process data analysis as required.

  9. Test Engineer

  10. Support test process setup, validation, and troubleshooting during pilot build and mass production.

  11. Assist in ensuring test coverage, stability, and repeatability to meet product and customer requirements.
  12. Analyze test data to identify failure trends and support yield improvement actions.

  13. Collaborate with cross-functional teams to support new product introduction (NPI) and engineering builds.

  14. Mechanical Engineering

  15. Provide mechanical engineering support for fixtures, tooling, and equipment used in assembly and testing processes.

  16. Assist in mechanical design review, improvement, and documentation using CAD tools (e.g. SolidWorks, e-drawing).
  17. Support installation, adjustment, and validation of mechanical tools and fixtures.

Job requirements:

  • Bachelor's Degree in Electronic Engineering, Mechanical Engineering, Electrical Engineering, or related field

    OR

    Minimum 3 years of relevant working experience in manufacturing environment.
  • Experience or exposure to assembly / semiconductor / SMT / PCBA / MOL / aligner / backfill / router manufacturing is an advantage

    (Fresh graduates may be considered for junior roles).
  • Basic to strong technical knowledge to support manufacturing, testing, or mechanical processes.
  • Knowledge of FMEA, Control Plan, and basic quality tools.
  • Experience in Wire Bond and Die Attach processes is an added advantage.
  • Familiar with mechanical CAD software (e.g. SolidWorks, e-drawing).
  • Good documentation skills for process specifications and work instructions.
  • Good computer literacy with ability to analyze and report data effectively.
  • Strong communication skills in English and Bahasa Malaysia.
  • Positive working attitude, able to work independently and in a team.
  • Willing to follow instructions and company policies.

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