Lead Principal Engineer Package Technology

2 days ago


Malacca City, Malaysia Infineon Full time 100,000 - 150,000 per year

Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3). Support pre development & project definition stage, and continue to be package design expert throughout project phase. Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics). 10 years of relevant working experience in IC/semiconductor environment. Semiconductor Packaging, Assembly and Test. Process and Equipment Engineering knowledge. Failure Analysis and Reliability Engineering. Analytical and Problem Solving Skills. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.



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