Die Bond

1 day ago

Bayan Lepas, Penang, Malaysia OSRAM Opto Semiconductors (Malaysia) Sdn Bhd Full time 60,000 - 120,000 per year

Description

  • Develop or optimize Die Bond and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
  • Participate and support FOL processes tehcnology roadmap and building block activities.
  • Equipment selection which meet project cost, quality and timeline target.
  • Share and transfer technical know how within R&D and to Manufacturing team.
  • Provide technical guidance or job coaching to junior supporting staff.
  • Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

Requirement

  • Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.

  • 5 years of experience in semiconductor field.


  • 5 years of experience in Die Bond and Wire Bond processes.


  • Process egnineering knowledge in semiconductors or LED manufacturing processes.
  • Knowledge in process development step and statistic.
  • B. Minitab knowledge will be advantage.
  • Six Sigma Green or Black Belt will be advantage.

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