BGA Process Engineer
14 hours ago
To be responsible and focus on the design, development, and optimization of Ball Grid Array components used in electronic devices, particularly in high-speed and high-density applications. Responsibilities include defining product requirements, optimizing BGA pinouts, and ensuring signal and power integrity, often collaborating with various teams to achieve optimal performance and manufacturability.
Key Responsibilities :
- Defining Product Requirements: Working with system architects and product teams to establish specifications for BGA components.
- Process Engineering- Develop and optimize BGA assembly processes (wire bond or flip chip, underfill, ball attach, reflow, cleaning).
- Process Engineering- Ensure robust BGA solder ball formation and reflow profiles and troubleshoot BGA-related assembly issues like voids, open/short balls, delamination, etc.
- Process Engineering- Lead process excursions and implement corrective/preventive actions
- Yield Improvement & Failure Analysis- Perform root cause analysis on assembly/packaging failures (e.g., solder cracks, head-in-pillow). Lead FA discussion with FA engineer for FA activities like X-ray, CSAM, SAT, Cross-sectioning, and SEM/EDX.
- Yield Improvement & Failure Analysis- working with customer to establish the rework process for certain defect.
- Manufacturing & Sustaining Support- Establish manufacturing process controls (SOPs, FMEAs, SPC), Monitor and maintain process KPIs (yield, defect rate, cycle time).
- Manufacturing & Sustaining Support- Lead process excursions and implement corrective/preventive actions
- Cross-functional Collaboration- Work closely with vendors, quality teams and Interface with customer on BGA packaging inquiries or issues
- Cross-functional Collaboration- Support new product introduction (NPI) and design for manufacturability (DFM).
- Knowledge of ISO 9001, ISO 14001, ISO 13485, IATF 16949 standards is a plus
Skills
Technical Skills:
- Knowledge of BGA packaging structure and substrate design.
- Familiarity with DDR, DFN memory architecture and QFN requirements.
- Hands-on experience with soldering, reflow, flux processes and cleaning .
- Understanding of JEDEC standards (MSL, package outline, thermal characterization).
- Experience with FA tools is a plus: X-ray, CSAM, SAT, cross-section, FIB.
Analytical & Problem Solving:
- Strong data analysis skills (yield trends, DOE, root cause analysis).
- Experience with statistical tools (JMP, Minitab, SPC charts).
- Knowledge of thermal/mechanical/electrical simulation tools is a plus.
Soft Skills:
Good communication and cross-functional teamwork.
Project management for new product introduction.
- Attention to detail and quality mindset.
- Ability to work with external vendors or customers.
Qualifications :
- Above 5 years of experience with Bachelor's degree in Engineering or Technology (Mechanical / Manufacturing Technology)
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