Wafer Saw Engineer

5 hours ago

Seremban, Negeri Sembilan, Malaysia Nexperia Full time 80,000 - 120,000 per year
About the Role

The Wafer Saw Engineer is responsible for managing and sustaining the wafer dicing process to ensure high yield, productivity, and product quality. The role requires strong technical ownership of equipment performance, process optimization, blade selection, and troubleshooting within a high-volume semiconductor manufacturing environment.

What You Will Do

  • Own and sustain wafer saw/dicing processes to achieve high yield, UPH, and stable operation.

  • Set up, calibrate, and maintain dicing equipment (e.g., DISCO, ADT, or equivalent).

  • Optimize sawing parameters (feed rate, spindle speed, cut depth, coolant flow, blade type) for different wafer technologies.

  • Conduct process qualifications, blade trials, and parameter optimizations for new products and materials.

  • Perform root cause analysis for issues such as chipping, edge crack, kerf variation, die loss, and blade wear.

  • Monitor process performance through SPC, Cpk studies, and trend analysis.

  • Analyze equipment data, alarms, and downtime to identify improvement opportunities.

  • Work with suppliers to evaluate new blades, tapes, chuck tables, and consumables.

  • Implement preventive maintenance schedules and equipment improvement plans to reduce unplanned downtime.

  • Collaborate with QA, PE, and production teams to ensure product compliance and smooth line operation.

  • Prepare documentation such as work instructions, setup procedures, troubleshooting guides, and engineering reports.

  • Drive cost-reduction, yield improvement, and process robustness projects.

What You Will Need

  • Bachelor's Degree in Mechanical, Electrical, Electronics, Materials, Mechatronics, or related engineering field.

  • Minimum 2–3 years experience in semiconductor wafer dicing/sawing processes (fresh grads considered for junior roles).

  • Hands-on experience with wafer saw equipment (DISCO, ADT, Accretech, etc.).

  • Strong understanding of blade selection, tape quality, wafer materials (Si, GaAs, SiC, etc.), and dicing mechanics.

  • Skilled in data analysis, SPC, DOE, FMEA, and root cause analysis.

  • Knowledge of wafer-level defects: chipping, micro-cracks, delamination, backside damage, kerf variation.

  • Good troubleshooting skills for both process and equipment issues.

  • Able to work in a fast-paced manufacturing environment with strong ownership and teamwork.

  • Good communication and report preparation skills.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

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