Senior Assembly Equipment Engineer

4 weeks ago


Malaysia Micron Full time

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR44232 Senior Assembly Equipment Engineer

As a Die Attach Equipment Engineer, you will be oversees the installation, modification, upgrade and maintenance of manufacturing equipment including studies equipment performance and reliability to ensure production equipment is in control and quality of product is meeting expectation; sustaining and improving key performance indices of the equipment through continuous improvement activities; reducing cost through qualifying 2nd source; ensuring effective and efficient equipment risk management strategy; continuous develop new capabilities ahead of needs.

Responsibilities and Tasks:
  1. Implement Preventive/Predictive maintenance program
  2. Develop equipment maintenance specification
  3. Monitor equipment performance key indicators and responsible to meet expectation
  4. Provide necessary production support
  5. Establish spare inventory system for key equipment
  6. Monitor spare cost and drive down liabilities of spare inventories
  7. Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
  8. Identify the key cost drivers and work on cost reduction programs
  9. Define, develop and maintain equipment capabilities, strategy and roadmap
  10. Maintaining a matrix on equipment capabilities and constraints
  11. Work with equipment suppliers to develop new material / capabilities
  12. Regularly conduct equipment benchmarking exercise
  13. Work with equipment suppliers to develop new capability
  14. Work with Package Development team to establish production capabilities for new products
Requirements:

Master / Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering

Minimum 3 years of working experience in semiconductor industry.

Knowledge in Die Attach, Devoid/oven curing will be added advantages.

Excellent interpersonal, communication and leadership skill with an extremely positive attitude towards working as a team.

Broad technical knowledge in problem solving analytical skill & lead an engineering team through innovative process implementation (FMEA, DOE, FDC/APC, DATA ANALYSIS)

Self-motivated, possess initiative and ability to work independently

Team player with good communication and interpersonal skills

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