Engineer Failure Analysis

Found in: Talent MY C2 - 1 week ago


Kulim, Malaysia Infineon Technologies Full time
In your new role you will:

Independent Physical Failure Analysis operation and job administration Provide consultation to customer related to PFA and determine the right analysis methods Identify problems or unfavorable deviations, recommend and execute/implement corrective/improvement actions which enhance the quality, reliability or cost effectiveness in the area of responsibility. Perform PFA generalist job, XSEM, Construction Analysis, Chemical & other within timeline independently Perform PFA specialist job, SEM/EDX, FIB Circuit Edit, PFA Flow,AFM/SCM, delayering, SRP, etc within timeline independently Support high impact jobs for IFKM (mainly) and IFX (globally) independently and being FA representative during the meeting Deliver a comprehensive, conclusive and good quality results and report for problematic wafers/samples which leading to root cause investigation Perform wafer and package sample preparation inclusive embedded cross-section, chemical delayering, XRAY,CSAM, Laser and Acid Decapsulation. Responsible to execute KPIs and assigned projects. Demonstrate simple to medium of mental, analytical skills and problemsolving. Ability to evaluate the problems and provide the solution Business Process Owned, Construction Analysis business owner, ICO/FAR/Task Force. Manage the PFA Flow & ICO jobs submission and distribution Compliance to lab instruction, VA, APA and SOP, safe chemical handling. Adhere to Environmental, Safety and ESD compliance regulations. Participate in IFX user group meeting, Contributor for Best Practice Sharing Tool / Area Owner (any PFA tool / area). Ensure 5S in place while in the office and FA lab You are best equipped for this task if you have:

holder in Electrical/Electronics Engineering or Applied Science with major in Physics/Chemistry/Material Science 0-1 years of experience in semiconductor or failure analysis field. Has experience in any of FA methods as following: SEM/EDX, FIB Circuit Edit, Analytical Service, SRP, AFM/SCM, AES, TEM (level 2), package analysis including XRAY,CSAM, Laser/Acid Decapsulation, wafer and package sample preparation inclusive embedded cross-section, chemical delayering.

Benefits

Coaching, mentoring networking possibilities Wide range of training offers & planning of career development International assignments Different career paths: Project Management, Technical Ladder, Management & Individual Contributor Flexible working conditions Holiday child care Medical coverage On-site social counselling and works doctor Health promotion programs On-site gym, jogging paths, beachvolleyball, tennis & soccer court On-site canteen Private insurance offers Flexible transition into retirement
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