Assembly Equipment Engineer

3 days ago

Malaysia Micron Technology Full time
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JR59025 Assembly Equipment Engineer (Wire Bonder)

As an Assembly Equipment Engineer, you will be leading a group of technicians who are responsible for the equipment used in the manufacturing process. You will ensure that the equipment is installed, modified, upgraded, and maintained accurately to meet the production requirements and quality standards. You will also analyze the equipment performance and reliability data to identify and implement improvement opportunities. You will work with vendors to qualify alternative sources of equipment and reduce costs. You will handle the equipment risk optimally and proactively develop new capabilities to meet future needs.

Responsibilities And Tasks
  • Implement a preventive/predictive maintenance program.
  • Develop equipment maintenance specifications.
  • Monitor equipment performance key indicators and be responsible for meeting expectations.
  • Provide vital production support.
  • Establish a spare inventory system for key equipment.
  • Manage spare cost and drive down liabilities of spare inventories.
  • Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy.
  • Identify the key cost drivers and work on cost-reduction programs.
  • Define, develop, and maintain equipment capabilities, strategy, and roadmap.
  • Maintain a matrix of equipment capabilities and constraints.
  • Work with equipment suppliers to develop new material/capabilities.
  • Regularly conduct equipment benchmarking exercises.
  • Work with Package Development team to establish production capabilities for new products.
Requirements
  • Master / Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering.
  • Excellent interpersonal, communication, and leadership skills with an extremely positive attitude towards working as a team.
  • In-depth knowledge and extensive experience with Wire Bonder.
  • At least 3 years working experience in Wire Bonder processes.
  • Experience with multi-stack Wire bonder process challenges.
  • APC data analytics knowhow.
  • Ability to work independently with a minimum of day-to-day supervision.
  • Experience with team leadership or supervising technicians.
  • Ability to work in a multi-functional team and under the pressure of multiple priorities, for example with NPI and process teams.
About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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