Pgdm - Penang Advanced Packaging Material Analysis
4 weeks ago
Support Physical Failure analysis operations (setup/ buyoff and output matching, inline monitor, defect finding, yield improvement) for the factory. Coordinate the probing, sample prep and defect finding within TPT and Success rate benchmarks. Coordinate with existing FA Labs in Malaysia when tool leveraging is needed. Coordinate with DMO LYA VF forums to maintain CE
**Qualifications**:
**Inside this Business Group**:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
**Posting Statement**:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
**Benefits**:
**Working Model**:
This role will require an on-site presence.
JobType
On-site Required
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