Technician 3, Lab

3 days ago

Batu Kawan, Malaysia Western Digital Full time

Company Description
At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

**Job Description**:

- Perform failure analysis on assembly and test defect from packaging development and production and qualification on finished products (SSD).
- Read and understand the test data log.
- Have hands-on experience performing physical failure analysis using FA tools such as X-ray, high and low microscope, SEM, EDX, TDR, Dye and Pry analysis and cross-sectioning etc.
- Generate FA report and assist engineer for root-causing of defect/s. Maintain the FA tracking sheet and FA equipment PM.

**Qualifications**:

- Diploma in electronics/ electrical engineering. Electrical background with adequate knowledge on semiconductor assembly process and technology
- At least 3 years FA hands-on experience on component or drivel level failure analysis
- Understand failure analysis methodology and flow such as 2D/3D X-ray, SEM/EDX, Dye and Pry Analysis, Package Cross-Section Analysis.
- Good communication skills
- Quick learning ability
- Decent English reading and writing skills.
- Good communication and presentation skills
- Good teamwork spirit
- Competent in technical FA report writing
- Previous electrical FA experience in IC or memory devices is a plus.

Additional Information
All your information will be kept confidential according to EEO guidelines.

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