Wirebond/Die Attach Process Engineering Manager

3 days ago

Malacca, Melaka, Malaysia Agensi Pekerjaan Asia Recruit Sdn Bhd Full time

Company Information

Our client, who is an established semiconductor manufacturer, is currently looking for a creative and high driven candidate to fill the position of Process Engineering Manager (Wire Bond / Die Attach), to be based in Melaka.

Benefits

  • 13th month salary
  • Variable performance bonus
  • Relocation allowance for outstation candidate up to 6 months

Responsibilities

  • Oversee and optimize the organization's manufacturing assembly processes (Wire Bond), including the development of product assembly procedures, FMEA, and process control standards.
  • Lead and coordinate all process engineering activities, ensuring efficient utilization of manpower, equipment, materials, and facilities to achieve production excellence.
  • Drive continuous improvement initiatives to enhance yield, quality, and cost efficiency year over year.
  • Lead, mentor, and develop a team of Process Engineers to deliver on company goals and operational objectives.
  • Collaborate with the R&D team to lead and coordinate process engineering activities in the design, development, implementation, and continuous improvement of systems, processes, and product assembly procedures.
  • Plan, direct, and oversee all process-related activities to ensure optimal utilization of manpower, equipment, materials, and facilities for maximum operational efficiency.
  • Plan and establish process engineering projects and follow up on performance against estimates.
  • Initiate cost reduction proposals, compile appropriate information, make recommendations for action, and confirm results obtained.
  • Manage, through process and procedure, the implementation of product design changes
  • Lead the identification, evaluation, and implementation of new equipment and processes, including sourcing, installation, validation, and training to support manufacturing readiness.

  • Collaborate closely with new product development teams to ensure effective design for manufacturability, addressing process, test, and assembly considerations early in the development stage.

  • Define the technical training in manufacturing techniques, methods and processes provided to manufacturing associates.

  • Ensure compliance of company policies, procedures, and objectives regarding processes, initiatives, and projects.
  • Continue improvement project to drive for yield and quality.
  • Coordinate and work with Quality team for the customer complaint and customer visit.

Requirements

  • Minimum a Bachelor's Degree in Electrical, Electronic, Mechanical or related disciplines
  • At least years working experience, preferably with 5 years of supervisory experience in semiconductor industry (Wire bonding process)
  • Possess team management skill
  • Familiar with Management System, coretools, statistical techniques, equipment & tools knowledges and troubleshooting skills
  • Preferably someone familiar with semiconductor wirebond / die attach / die bond process
  • Must be willing to work in Melaka

Interested candidate may apply online or email to OR

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