Product Engineering
2 days ago
Job Description
BE Team
1) Coordinate with production control for pilot lots, returns, and engineering wafers final out
2) Prepare special process checklists for BE1 and BE2
3) Maintain process station flows
4) Create and modify MES process parameters
5) Drive improvements projects and system enhancement
Bumping Team
1) Support pilot lots, returns, and engineering wafer final outs with production control
2) Maintain product specification, forms, and create EDC entries
3) Modify and maintain process station / machine group settings
4) Update process parameters and product spec
5) Configure backup masks and stencils
6) Manage mask hold/ scrap and product data
7) Set up mass production configurations for new product
FA Team
1) Analyze customer complaint issues
2) Analyze process improvement results
3) Analyze experimental data for new process introduction
4) Manage FA case scheduling and operate FA lab equipment and perform basic troubleshooting
5) Purchase and manage lab consumables ( exp: polishing materials, liquid nitrogen, sputter, targets)
6) Maintain lab equipment and environment
Packaging Design Team
1) Evaluate customer specifications (CRN/ CDR), conduct discussion and compile data for customer confirmation
2) Handle systems anomalies (contact and data confirmation)
3) Maintain packaging BOM and material info
4) Evaluate and test new packaging materials / second sources
5) Maintain packaging systems and consolidate PK Verify results for various customers and optimize the workflow
6) Manage shipment without ERP records or with special labelling requirements
Job Requirements
1)Bachelor's degree in related engineering field, with at least 1 year of product engineering working experience in semiconductor industry. Fresh Graduate are encouraged to apply as well.
2) The above positions require proficiency in Mandarin, English, as the position involves frequent coordination and reporting to the Taiwan headquarters and Mandarin-speaking clients.
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