Mold Engineer

2 days ago

Malacca, Melaka, Malaysia ATX SEMICONDUCTOR (MELAKA) SDN. BHD. Full time

Key Responsibilities

  • Develop, qualify, and sustain molding processes for semiconductor packages, ensuring compliance with internal standards and customer requirements.
  • Lead troubleshooting and root-cause analysis for mold-related defects (e.g. voids, delamination, cracks, package warpage).
  • Support NPI, package transfer, and product change activities, including process setup, validation, and documentation.
  • Optimize molding parameters, materials, and tooling to improve yield, reliability, and cycle time.
  • Collaborate with quality, reliability, equipment, and production teams to drive continuous improvement initiatives.
  • Monitor process capability, SPC trends, and key KPIs; implement corrective and preventive actions where required.
  • Support customer audits, technical reviews, and failure analysis related to molding processes.

Qualifications & Experience

  • Degree in Engineering (Mechanical, Materials, Chemical, or equivalent).
  • Minimum 3–5 years of hands-on experience in semiconductor IC packaging, with strong exposure to molding processes.
  • Solid understanding of epoxy molding compounds, mold tooling, and package reliability requirements.
  • Proven problem-solving capability, data-driven mindset, and ability to operate in a high-volume manufacturing environment.
  • Strong stakeholder management and communication skills.
  • Ability to communicate in Chinese language a plus point.

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