Engr Sr, Package Development_Tl

onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.

• Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
• Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
• Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
• Conducts DFM (Design for Manufacturability) reviews with a focus on solder/ wire joint integrity and thermal profiles.
• Develops and executes process validation plans including DOE, capability studies, and reliability testing.
• Supports prototype builds and pilot runs, analyzing soldering diebond and wirebond performance and implementing improvements.
• Creates and maintains detailed documentation including work instructions, process flows, and FMEAs.
• Evaluates and qualifies soldering diebond and wirebond equipment, materials (e.g., solder paste, flux), and tooling.
• Implement automation and inspection technologies such as AOI, X-ray, and solder paste inspection (SPI).
• Drives root cause analysis and corrective actions for soldering-related defects and yield issues.
• Works closely with suppliers to evaluate and qualify soldering diebond and wirebond materials and equipment.
• Ensures compliance with IPC standards (e.g., IPC-A-610, J-STD-001) and customer requirements.
• Tracks and reports NPI metrics including yield, defect rates, and process stability.

Competencies:

The ideal candidate should demonstrate proficiency in:

• In-depth knowledge of soldering diebond and wirebond processes including reflow, wave, selective, and hand soldering.
• Experience with SMT assembly, solder paste printing, and thermal profiling.
• Familiarity with IPC standards and solder joint inspection criteria.
• Strong understanding of materials behavior under thermal and mechanical stress.
• Proficiency in statistical tools (SPC, DOE, FMEA) and data analysis.
• Excellent project management and cross-functional collaboration skills.
• Strong problem-solving and troubleshooting capabilities.
• Effective communication and documentation skills.
• Ability to manage multiple projects in a fast-paced environment.

Requirements:

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electronics Engineering, or related field.
• 3+ years of experience in NPI or process engineering with a focus on soldering in electronics or semiconductor manufacturing.
• Hands-on experience with soldering equipment, reflow ovens, and inspection systems.
• Proficiency in MS Office tools; advanced Excel skills required.
• Experience with MES systems; Wonderware experience is a plus.
• Familiarity with ISO and quality management systems.