Engr Prin, Package Development

2 days ago

Seremban, Negeri Sembilan, Malaysia onsemi Full time 80,000 - 120,000 per year
Description

Job Summary: 

· Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. 

· Key person responsible to align processes between R&D and Manufacturing. 

· Establish process POR through set up, feasibility and characterization followed by package development procedure. 

Responsibilities

Responsibilities

· End of Line process development and enabling technology for molded package. 

o    Capable to understand the design and proposal for improvement from End of Line process. 

o    Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA. 

o    Familiar with EMC materials. 

o    Capability to define KPIV from failures modes. 

o    Capability to define KPOV and generate output by analyzing process capability. 

o    Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab). 

o    Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc.).  

· Technical Leadership on End of Line Process. 

o    Capable to initiate new process and equipment working with technical leader and supplier. 

o    Responsible for P.O spec generation and buy-off. 

o    Capable to create COO for new process and equipment. 

o    Capable for benchmarking on the new and better process/equipment which do not exist in company. 

o    Capability to create End of Line process technology roadmap, especially for molding. 

o    Capability to generate new design rule based on characterization, working with technical leader and designer. 

o    Capable to understand customer requirements, application and EHS. 

o    Capable to find systematic solution and improvement planning for process defects. 

o    Supporting quality issue during production, effectively working with manufacturing team. 

Qualifications

Requirements:

· years in package development. 

· Experienced areas: Molding and/or singulation process development. 

· Experienced packages: Transfer molded power module (Intelligent Power Module, Dual Side Cooling Module, Power Discrete) is an advantage. 

· Degree or Master in any Engineering fields. 

· Familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (PowerPoint presentation). 

· Personal characteristics: Self-motivated, independent, open mind to communicate, willing to take risk and ability to manage people and task. 

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040. 

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