Die Attach Engineer

2 days ago

Malacca, Melaka, Malaysia ATX SEMICONDUCTOR (MELAKA) SDN. BHD. Full time

Key Responsibilities

  • Develop, qualify, and maintain die attach processes for various IC packages, ensuring alignment with design, quality, and customer specifications.
  • Own troubleshooting and root-cause analysis for die attach defects such as die tilt, voids, epoxy bleed, non-stick, and delamination.
  • Support NPI, package transfer, and process change activities, including DOE, validation, and documentation.
  • Optimize materials (epoxy, solder, film), equipment parameters, and tooling to improve yield, throughput, and reliability.
  • Partner with quality, reliability, equipment, and production teams to drive continuous improvement and cost reduction initiatives.
  • Monitor SPC, process capability, and key performance indicators; lead corrective and preventive actions where required.
  • Support customer audits, technical discussions, and failure analysis related to die attach processes.

Qualifications & Experience

  • Degree in Engineering (Mechanical, Materials, Chemical, Electrical, or equivalent).
  • Minimum 3–5 years of hands-on experience in semiconductor IC packaging, with strong exposure to die attach processes.
  • Solid understanding of die attach materials, bonding mechanisms, and package reliability fundamentals.
  • Structured problem-solving skills with a data-driven and disciplined execution mindset.
  • Strong cross-functional communication and stakeholder management capabilities.

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