Senior Package Reliability Engineer

Found in: Talent MY C2 - 2 weeks ago

Simpang Ampat, Malaysia Micron Full time

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR46389 Senior Package Reliability Engineer

As a GQ (Global Quality) Package Reliability Engineer in the Product Quality and Reliability Assurance team at Micron Technology Inc., the main responsibility is package quality and reliability for one of Micron’s product lines.

Responsibilities and Tasks:

Lead Regulation for New Product Qualifications

Coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced Provide comprehensive qualification plans for new developments Provide recommendations on product release based on package reliability test results


Design and Implement Reliability Test Plans

Devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues Provide advice for accurate screen method for quality concerned lots Sustain appropriate monitoring methodology for quality


Regulate Root Cause and Corrective Action Plans

Lead 8D report processes Coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers) Prepare reports for discussion with partners.


Act as a liaison for both Internal and External Customers

Evaluate whether internal and external customer requests are reasonable and acceptable for Micron quality policy Provide technical support for package-related quality and reliability issues Supply technical expertise for customer requests

For senior position:

Leading other engineers to achieve goals of team Provide advice and guidance to other engineers, mentor, and develop talent

Requirements:

Education back ground of a min Bachelor’s Degree in Electronics, Material Science, Mechanical or equivalent experience Detailed knowledge of semiconductor component package assembly processes and challenges Knowledge of surface mount processes and challenges Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies Good understanding of the effects thermo mechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability Good understanding of industry standard reliability test methods of package level and board level, acceleration models used for life predictions, and sampling statistics preferred Must be self-motivated, able to work independently, and detail oriented Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups Good written and verbal communication skills in English and digital literacy are vital Ability for other Asian languages, especially Chinese and Japanese, can be a plus Good understanding of the software systems employed in backend manufacturing Understanding of statistics and quality management (SPC, FMEA, 8D CAR, etc.)

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