Principal Engineer Package Technology Development

4 hours ago

Ipoh, Perak, Malaysia Infineon Full time 120,000 - 180,000 per year

Bachelor's or Master's degree in a relevant field, such as Materials Science, Mechanical Engineering, Electrical Engineering Chemical Engineering, Physics. Over 10 years of experience in package development, process development(assembly and testing), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects. Good technical knowledge of Back End processes & material knowledge in lead frame, AMB, module and power packages and interaction to the different functions (eg. design rules, direct materials and processes qualification). Good understanding of Automotive quality / reliability requirements and standards. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

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