Senior NPI Process Engineer

2 weeks ago

Johor Bahru, Johor, Malaysia Celestica Full time 60,000 - 120,000 per year

Summary

We seek a seasoned NPI Process Engineer to drive the seamless transition of complex printed circuit board assemblies (PCBA) from design to volume production. You'll own NPI readiness for high-mix, low-volume SMT manufacturing, ensuring robust processes, resolving technical roadblocks, and optimizing build efficiency. Your expertise in BOM structures, DFM/DFT, and SMT process excellence will be critical to success.

Key Responsibilities

NPI Process Leadership

  • Lead end-to-end NPI preparation for SMT-based PCBA products, including process validation, workflow design, and documentation (PFMEAs, control plans, work instructions).
  • Conduct DFM/DFT reviews with design teams to mitigate manufacturing risks and optimize BOM/AVL (Approved Vendor List) alignment.
  • Develop SMT process recipes (stencil design, solder paste, reflow profiles) for complex, mixed-technology assemblies.

BOM & Configuration Management

  • Analyze and validate complex multi-level BOMs, ensuring accuracy, alternate component management, and lifecycle compliance.
  • Resolve BOM discrepancies, obsolescence issues, and supply chain challenges during NPI phases.

High-Mix/Low-Volume (HMLV) Optimization

  • Design flexible processes for rapid product changeovers and low-volume efficiency.
  • Troubleshoot PCBA defects (solder defects, component placement, ICT/FCT failures) using root-cause analysis (8D, Fishbone).
  • Implement statistical process control (SPC) for critical-to-quality (CTQ) parameters in SMT lines.

Cross-Functional Collaboration

  • Partner with Design, Test, Supply Chain, and Customer to resolve build issues and ensure on-time delivery.
  • Mentor junior engineers and technicians on NPI best practices.

Continuous Improvement

  • Drive yield improvement, cost reduction, and process scalability initiatives.
  • Drive and ensure compliance with quality standards (IPC-A-610, J-STD-001).

Required Qualifications

Education:
BS/MS in Mechanical, Electrical, Industrial Engineering, or related field.

Experience:

  • 7+ years in NPI process engineering within PCBA/SMT manufacturing
  • Proven expertise in complex BOM structures (multi-level, configurable, ECO management).
  • Hands-on experience with SMT processes (screen printing, SPI, pick-and-place, reflow, AOI, X-ray).
  • Track record solving high-mix/low-volume PCBA production challenges.

Technical Skills:

  • DFM/DFT, PFMEA, Process validation
  • CAD tools (Valor) and MES.
  • Root-cause analysis (8D, 5 Whys), SPC, and Lean methodologies.
  • Familiar Standards: IPC-A-610, IPC-J-STD-001, IPC-7711/21.

Preferred Qualifications:

  • Experience with flex/rigid-flex PCBA, press-fit connectors, or box-build integration.
  • Knowledge of automation solutions for HMLV environments.
  • Six Sigma Green/Black Belt certification.
  • Familiarity with Industrial product or medical device manufacturing.

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