Die Attach Engineer/Senior Engineer

1 week ago


Muar, Johor, Malaysia STMicroelectronics Sdn Bhd Full time $80,000 - $120,000 per year

Responsibilities:

  • To develop and to industrialize new die attach process & material (Soft Solder, Die Attach Glue, Die Attach Film) for new lead frame packages, to meet the yield and quality requirement.
  • To qualify new package, products and new die attach technology.
  • To support Qualification/ Engineering samples for new packages, new products or new technologies.
  • To review and update Process Specification, FMEA, OCAP and Process Control Plan.
  • To provide technical support when there is critical quality concern related to Die Attach material or process.

Requirements:

  • Master's or bachelor's degree in Mechanical engineering / Material Science / Electrical Engineering / Electronics Engineering or equivalent engineering field.
  • Minimum 3 years of working experience in die attach process (Soft Solder, die attach glue, die attach film).
  • Candidate with soft solder process experience will be an added advantage.
  • Strong technical knowledge on process and material know-how.
  • Skill in Design of Experiment (DOE) in SAS-JMP will be added advantage.
  • Skill in analytical trouble shooting.
  • Good interpersonal skills and able to work well under pressure.


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