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Field Service Technician

3 weeks ago


Bayan Lepas, Penang, Malaysia PacTech Full time
Company Overview:

PacTech is a global leader in wafer level packaging technologies and advanced packaging equipment manufacturing. With over 20 years of experience, we have developed expertise in chemical engineering, material science, backend processing, and wafer level packaging.

Job Description:

We are seeking individuals with strong backgrounds in chemical engineering, material science, or relevant fields to join our PacTech Asia operations. As a Field Service Engineer, you will be responsible for troubleshooting, installation, and maintenance of designated equipment.

Required Skills and Qualifications:
  • Minimum Bachelor's degree in Engineering or Science Discipline
  • At least 3 years of experience as a process, field service, or application engineer in the semiconductor industry
  • Familiarity with thin film deposition, SMT, Cu-RDL, or Cu-Pillar, or WLP in general
  • Good presentation, communication, and team working skills
Benefits:
  • Opportunity to work with a worldwide leader in wafer level packaging technologies
  • Chance to expand your technical knowledge and skills
  • Collaborative team environment