Pgdm Shift Group Leader

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for over five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Responsibilities will include, but are not limited to:

- Responsible for the appropriate training, mentoring, coaching, and performance management of the Equipment/Manufacturing Technicians in a manner which enables PGDM to meet critical goals.
- Establish a strong and collaborative relationship with peers, other Shift Group Leaders, Module (Engineering) Group Leaders and cross area support teams.
- Establishes tactical plans to ensure production schedules are met within established PM ( Preventive Maintenance), equipment improvement, quality and cost objectives.
- Understands scheduled and unscheduled equipment maintenance, repair, recovery, troubleshooting, tool quality, and tool run rate, ensuring equipment indices are met.
- Drive operational expertise and excellence across all modules/shifts of the organization with strict adherence to Factory/Department standards.
- May require to certify and be part of the Shift Safety team Incident Command Structure ( ICS)
- Assign personnel to maintenance tasks and monitors the progress of work in process.
- Establish and ensure maintenance policies and procedures are followed.
- Set priorities for the team, ensure an inclusive work environment, develop employees, and manage performance.
- Assesses personnel staffing and maintenance plans to accommodate production schedules with mínimal impact.
- Coordinate multiple functions within a manufacturing facility, establishing strategic toolset plans, including training capability to ensure production schedules are met within established time, quality, and cost objectives.
- Use business acumen and judgement on a variety of problems requiring deviation from standard practices.
- Drive Module and Department level improvement and other programs.
- Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process start-up to high volume manufacturing.
- Interacting with partner factories worldwide to transfer new equipment/processes, maintain CE (copy exactly) parameters, best known method learnings and drive strategic improvement projects.

**Qualifications**:

- BS/3+ years in Chemical/Materials/Mechanical/Mechatronic/Electrical/Engineering or equivalent, with industry experiences in semiconductor field.
- MS/2+ years in Chemical/Materials/Mechanical/Mechatronic/Electrical/Engineering or equivalent, with industry experiences in semiconductor field.
- PhD in Chemical/Materials/Mechanical/Mechatronic/Electrical/Engineering or equivalent. Preferred Qualifications:

- 5+ years' experience in Dry Etch/Implant equipment.
- Must be a self-starter, highly organized, and have an ability to work independently across organizations.
- Understanding of semiconductor process flow technology and theory of constraint management.
- Experience in a semiconductor industry related environment in Dry Etch/Implant equipment.
- Strong technical/ engineering background in wafer fabrication. Proven track record in technical problem solving and able to provide solution to overcome complex technical challenges.
- Excellent communication skills with a high tolerance for ambiguous and dynamic situations.
- Ability to coordinate, lead, and develop teams (improvement, preventative, corrective, and sustaining).
- People interactive skills with all organization levels in a diverse environment.
- Manage the achievement of area maintenance and output goals while exercising good judgment on a variety of problem situations and sustaining the values of safety and quality.

**Inside this Business Group**:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring