IP Engineering Director

1 day ago

Bayan Lepas, Penang, Malaysia Reeracoen Malaysia Full time 120,000 - 360,000 per year

Our client is a cutting-edge semiconductor solutions provider specializing in advanced SoC, chiplet, and multi-die technologies. With a focus on high-performance, low-power, and scalable designs, they are driving next-generation innovations that power data centers, AI, automotive, and consumer applications worldwide.

They are seeking a
highly skilled and visionary IP Engineering Director
to lead the development and delivery of reusable semiconductor IP. This role is ideal for a proven leader who can define technical roadmaps, drive execution, and build world-class teams while collaborating across hardware and software domains to deliver silicon-proven solutions.

Key Responsibilities

1. Leadership & Strategy

  • Define and execute the IP engineering roadmap aligned with overall product strategy.
  • Build, lead, and mentor a world-class engineering team across design, verification, validation, and integration.
  • Foster a culture of innovation, collaboration, and technical excellence.
  • Drive continuous improvement in design methodology, automation, and productivity.

2. IP Development & Execution

  • Lead architecture, micro-architecture, and RTL design of reusable IP (e.g., high-speed I/Os, memory interfaces, SerDes, interconnects, accelerators).
  • Oversee verification, validation, and sign-off for robust, silicon-proven IP.
  • Collaborate with SoC, packaging, and system teams for seamless IP integration into chiplet and multi-die systems.
  • Support post-silicon bring-up, debug, and deployment.

3. Cross-Functional Collaboration

  • Partner with software teams to ensure HW/SW co-design and full-stack enablement.
  • Engage with system architects and product teams to align IP functionality with market requirements.
  • Collaborate with foundries, EDA vendors, and ecosystem partners to enhance design flows.

4. Program Management & Delivery

  • Own IP program planning, milestones, schedules, and risk management.
  • Ensure high-quality IP delivery on time to both internal teams and external customers.
  • Promote IP scalability and reuse across multiple product lines.

Required Experience

  • Bachelor's or Master's in Electrical Engineering, Computer Engineering, or related field (PhD a plus).
  • At least 15 years in semiconductor design with 5 years in a senior leadership or director role.
  • Proven track record of delivering silicon-proven IP in SoCs or ASICs.
  • Strong background in digital design (RTL, synthesis, STA), mixed-signal design, or high-speed interfaces.
  • Knowledge of verification methodologies, DFx, and post-silicon validation.
  • Familiarity with advanced packaging (2.5D/3D IC, chiplets, interposers) is a strong plus.
  • HW/SW development experience (firmware, device drivers, or modeling) highly desirable.
  • Excellent leadership, communication, and customer-facing skills.

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