Wire bond engineer
4 days ago
Job Description
Wire Bonding Process Development: Design, develop and optimize wire bonding processes for semiconductor devices. Select appropriate bonding materials (e.g., aluminium, copper or gold wires) and parameters for specific applications. Perform design of experiments (DOE) to improve bonding quality and yield.
Quality Assurance: Monitor and analyze wire bonding quality using tools such as shear tests, pull test, and microscopy. Identify and resolve defects such as non-sticks, wire breaks or bond lifts. Implement corrective actions to improve yield and reliability.
Process Documentation: Create and maintain detailed documentation of wire bonding processes, including Standard Operating Procedures and work instructions. Ensure compliance with industry standards (e.g. JEDEC, QES).
Cross-Functional Collaboration: Work closely with design, maintenance and quality teams to ensure seamless integration of wire bonding processes into mass production. Provide technical support to production teams and resolve process-related issues.
Continuous Improvement: Identify opportunities for process optimization and cost reduction. Stay updated on industry trends and advancements in Semiconductor Assembly technology.
Job Qualification
Bachelor's Degree in Electrical Engineering, Mechanical Engineering & Materials Science.
Minimum 3+ years of experience in Semiconductor backend assembly processes with strong understanding of wire bonding techniques (e.g. ball bonding, wedge bonding, etc.)
Hands-on experience with wire bonding equipment and tools.
Proficiency in statistical analysis and process control tools (e.g., SPC, FMEA).
Familiarity with CAD software for bond pad design and analysis is a plus.
Excellent problem-solving and analytical skills with high attention to detail.
Strong communication and interpersonal skills with the ability to work effectively in a team environment.
Ability to communicate in Mandarin language is an added advantage.
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